What is Void Filler - Overview?

Void Filler is cement based crack filling system that is used to regulate an uneven substrate in preparation for the application of a resin bonded paving system. It has been produced to be strong, have good adhesion and be easy to apply to most commonly encountered surfaces.

Where can Void Filler be used?

All commonly encountered surfaces and substrates such as asphalt and concrete. These substrates are often not smooth which is referred to as having a surface texture. The degree of surface texture can be measured as 'texture depth' using the standard sand patch test.

To achieve a successful resin bonded installation a flat, relatively smooth surface is required. If a surface is not smooth, the applied resin will sink into the undulations of the surface, leaving insufficient resin available to bond the aggregate in position. This could cause an unsuccessful resin bonded installation. The other impact that the uneven surface will have when installing a resin bonded system, is the increased amount of resin that will be required. It is to be expected that every 1mm of surface texture depth will require an additional 1 litre of resin per square just to bring the resin level so that it can achieve a good bond with the aggregate. This will dramatically effect the cost of installation a resin bonded system as twice as much resin will be used.

By using Void Filler to bring the surface level, not only will it enable the resin bonded system to be correctly installed with good adhesion, but the cost will be predictable and controllable.

Application

Application is straightforward, first shake the base container pack A several times to ensure the powder has not separated, then pour the liquid component pack B into the base container and mix thoroughly for several minutes using a drill and paddle. Pour the resultant mix on to the substrate. Next use a flat bladed squeegee to spread the Void Filler over the uneven surface ensuring the negative texture is filled. We recommend finally sweeping the void filled surface with a stiff broom to give it a slight texture ideal for the resin to adhere to when installing a resin bonded system. The new even surface is left to cure.

The substrate must be clean, contamination and dust free prior to a Void Filler application.

Technical

Void Filler is supplied as a 25kg cold applied two component pack, consisting of a powder base (Pack A) and a liquid additive (Pack B). It has been developed as a polymer modified cementitious void filler and surface regulator.